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Entegris

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American supplier
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Entegris, Inc.
Company typePublic
Traded as
IndustryMicroelectronics materials and components
Founded1966; 58 years ago (1966)
HeadquartersBillerica, Massachusetts, U.S.
Key peopleBertrand Loy (CEO & president)
Linda LaGorga (CFO
RevenueIncrease US$3.5B 2023 net sales
Number of employees8,000 worldwide
Websiteentegris.com

Entegris, Inc. is a supplier of materials for the semiconductor and other high-tech industries. Entegris has approximately 8,000 employees throughout its global operations. It has manufacturing, customer service and/or research facilities in the United States, Canada, China, Germany, Israel, Japan, Malaysia, Singapore, South Korea, and Taiwan. The company’s corporate headquarters are in Billerica , Massachusetts.

The company seeks to help manufacturers increase their yields by improving contamination control in several key processes, including photolithography, wet etch and clean, chemical-mechanical planarization, thin-film deposition, bulk chemical processing, wafer and reticle handling and shipping, and testing, assembly and packaging. Approximately 80% of the company's products are used in the semiconductor industry.

Products

Entegris products include: filtration products that purify process gases and fluids, as well as the ambient environment; liquid systems and components that dispense, control, or transport process fluids; high-performance materials and specialty gas management solutions; wafer carriers and shippers that protect the semiconductor wafer from contamination and breakage; and specialized graphite, silicon carbide, and coatings.

History

The company was incorporated in 1999 as the combined entity of Fluoroware, Inc., which began operating in 1966, and EMPAK, Inc. The company went public in 2000.

In August 2005, Entegris merged with Mykrolis Corporation, a publicly held supplier of filtration products to the semiconductor industry. Mykrolis was spun-out of Millipore Corporation in 2000.

In August 2008, Entegris acquired Poco Graphite, Inc., a Decatur, Texas supplier of specialized graphite and silicon carbide products for use in semiconductor, EDM, glass bottling, biomedical, aerospace, and alternative energy applications.

On April 30, 2014, Entegris acquired Danbury, Connecticut-based ATMI, a publicly held company providing critical materials and materials-handling solutions to the semiconductor industry, in a $1.1 billion transaction.

In Dec 2020, Entegris announced an investment of US$500 million, building a state-of-the-art facility in Taiwan. The project is expected to complete in three years in Kaohsiung Science Park.

In July 2022, Entegris acquired another US semiconductor chemicals company, CMC Materials Inc, for $5.7 billion. The acquisition, previously known as Cabot Microelectronics Corp, had 2,200 employees.

References

  1. "Entegris Makes Major Investment in New Manufacturing Facility in Taiwan | Dec 20, 2020 | Entegris, Inc". investor.entegris.com. Retrieved 2021-12-09.
  2. "American company Entegris expands investment in Taiwan". 8 December 2021.
  3. "Entegris steps up investment in Taiwan". DIGITIMES. 9 December 2021. Retrieved 2021-12-09.
  4. News, Taiwan (2021-12-08). "Semiconductor industry supplier Entegris expands investments in Taiwan | Taiwan News | 2021-12-08 17:29:00". Taiwan News. Retrieved 2021-12-09. {{cite web}}: |last= has generic name (help)
  5. Nair, Aishwarya; Hu, Krystal (2021-12-15). "Chip materials supplier Entegris to buy rival CMC in $6.5 bln deal". Reuters. Retrieved 2022-07-18.
  6. "Entegris Completes Acquisition of CMC Materials, Solidifying Position as the Global Leader in Electronic Materials | Jul 06, 2022 | Entegris, Inc". investor.entegris.com. Retrieved 2022-07-18.
  7. Materials, C. M. C. (2020-10-01). "Cabot Microelectronics Corporation Announces It is Now CMC Materials, Inc. and Declares Quarterly Cash Dividend". GlobeNewswire News Room (Press release). Retrieved 2022-07-18.
  • Li1, S., Shih, S., Yen, S., Yang, J.: "Case Study of Microcontamination Control." Aerosol and Air Quality Research, Vol. 7, No. 3, pp. 432–442, 2007
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