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|Date = 20:18, 20 March 2008 (UTC) | |Date = 20:18, 20 March 2008 (UTC) | ||
|Author = Nextreme Thermal Solutions | |Author = Nextreme Thermal Solutions | ||
|Permission = {{GFDL-self}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. | |Permission = {{GFDL-self|migration=relicense}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. | ||
Subject to ]. | Subject to ]. | ||
}} | }} | ||
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Latest revision as of 04:42, 30 December 2011
Description |
SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors | ||||
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Source |
self-made, Nextreme Thermal Solutions | ||||
Date |
20:18, 20 March 2008 (UTC) | ||||
Author |
Nextreme Thermal Solutions | ||||
Permission (Reusing this file) |
Subject to disclaimers.
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current | 20:18, 20 March 2008 | 370 × 355 (117 KB) | Kvongunten (talk | contribs) | {{Information |Description = SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions | |
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