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|Date = 20:18, 20 March 2008 (UTC) |Date = 20:18, 20 March 2008 (UTC)
|Author = Nextreme Thermal Solutions |Author = Nextreme Thermal Solutions
|Permission = {{GFDL-self}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. |Permission = {{GFDL-self|migration=relicense}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.


Subject to ]. Subject to ].
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Latest revision as of 04:42, 30 December 2011

File information
Description

SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors

Source

self-made, Nextreme Thermal Solutions

Date

20:18, 20 March 2008 (UTC)

Author

Nextreme Thermal Solutions

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current20:18, 20 March 2008Thumbnail for version as of 20:18, 20 March 2008370 × 355 (117 KB)Kvongunten (talk | contribs){{Information |Description = SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions |

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