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Revision as of 20:18, 20 March 2008 editKvongunten (talk | contribs)19 edits {{Information |Description = SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions |  Revision as of 03:31, 24 March 2008 edit undoJusjih (talk | contribs)Administrators21,029 edits {{GFDL-self}}Next edit →
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|Date = 20:18, 20 March 2008 (UTC) |Date = 20:18, 20 March 2008 (UTC)
|Author = Nextreme Thermal Solutions |Author = Nextreme Thermal Solutions
|Permission = Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. |Permission = {{GFDL-self}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.


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Revision as of 03:31, 24 March 2008

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Description

SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors

Source

self-made, Nextreme Thermal Solutions

Date

20:18, 20 March 2008 (UTC)

Author

Nextreme Thermal Solutions

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Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

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