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Revision as of 03:31, 24 March 2008 editJusjih (talk | contribs)Administrators21,029 edits {{GFDL-self}}← Previous edit Revision as of 10:38, 14 September 2009 edit undoMGA73bot (talk | contribs)Extended confirmed users178,674 editsm Changing license in the big license migrationNext edit →
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|Date = 20:18, 20 March 2008 (UTC) |Date = 20:18, 20 March 2008 (UTC)
|Author = Nextreme Thermal Solutions |Author = Nextreme Thermal Solutions
|Permission = {{GFDL-self}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. |Permission = {{GFDL-self|migration=relicense}}Permission is granted to copy, distribute and/or modify this document under the terms of the ], Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.


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Revision as of 10:38, 14 September 2009

File information
Description

SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors

Source

self-made, Nextreme Thermal Solutions

Date

20:18, 20 March 2008 (UTC)

Author

Nextreme Thermal Solutions

Permission
(Reusing this file)
GFDLI, the copyright holder of this work, hereby grant the permission to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

GFDL GNU Free Documentation License //en.wikipedia.org/Wikipedia:Text_of_the_GNU_Free_Documentation_License


This work is licensed under the Creative Commons Attribution-ShareAlike 3.0 License.

This licensing tag was added to this file as part of the GFDL licensing update.

Cc-by-sa-3.0Attribution-ShareAlike 3.0https://creativecommons.org/licenses/by-sa/3.0/
Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

Subject to disclaimers.


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current20:18, 20 March 2008Thumbnail for version as of 20:18, 20 March 2008370 × 355 (117 KB)Kvongunten (talk | contribs){{Information |Description = SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions |

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