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| ] potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box]] | ] potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box]] | ||
| In ], '''potting''' is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermo-setting plastics or silicone rubber gels are often used. | In ], '''potting''' is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermo-setting plastics or silicone rubber gels are often used. | ||
| Most circuit board assembly houses coat assemblies with a layer of transparent ] rather than potting.{{ |
Most circuit board assembly houses coat assemblies with a layer of transparent ] rather than potting.{{citation needed|date=August 2012}} Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. | ||
| When potting a circuit board that uses ], low ] (T<sub>g</sub>) potting compounds such as ] or ] are used, because high T<sub>g</sub> potting compounds may break solder bonds as they harden and shrink at low temperatures.<ref>http://www.pottingsolutions.com/my%20site/Technology/potting_hints.htm#Potting%20PC%20boards</ref> | When potting a circuit board that uses ], low ] (T<sub>g</sub>) potting compounds such as ] or ] are used, because high T<sub>g</sub> potting compounds may break solder bonds as they harden and shrink at low temperatures.<ref>http://www.pottingsolutions.com/my%20site/Technology/potting_hints.htm#Potting%20PC%20boards</ref> | ||
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| == References == | == References == | ||
| {{ |
{{reflist}} | ||
| ==External links== | ==External links== | ||
| * {{dmoz|Business/Chemicals/Polymers/Plastics/Resins_and_Compounds/Polyurethane/|polyurethane potting}} | * {{dmoz|Business/Chemicals/Polymers/Plastics/Resins_and_Compounds/Polyurethane/|polyurethane potting}} | ||
| * {{dmoz|Business/Chemicals/Polymers/Rubber/Synthetic/Silicone/|silicone potting}} | * {{dmoz|Business/Chemicals/Polymers/Rubber/Synthetic/Silicone/|silicone potting}} | ||
| * {{dmoz|Business/Chemicals/Polymers/Plastics/Resins_and_Compounds/Epoxy_Resins/|epoxy resin potting}} | * {{dmoz|Business/Chemicals/Polymers/Plastics/Resins_and_Compounds/Epoxy_Resins/|epoxy resin potting}} | ||
| * {{dmoz|Business/Chemicals/Coatings_and_Adhesives/Adhesives/|adhesive potting compounds}} | * {{dmoz|Business/Chemicals/Coatings_and_Adhesives/Adhesives/|adhesive potting compounds}} | ||
| ⚫ | {{Electronics-stub}} | ||
| ] | ] | ||
| ] | ] | ||
| ⚫ | {{Electronics-stub}} | ||
Revision as of 09:47, 4 February 2013
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In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermo-setting plastics or silicone rubber gels are often used.
Most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair.
When potting a circuit board that uses surface-mount technology, low glass transition temperature (Tg) potting compounds such as polyurethane or silicone are used, because high Tg potting compounds may break solder bonds as they harden and shrink at low temperatures.
See also
References
External links
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