Misplaced Pages

File:Intel-presler-copper-pillar-bump.png

Article snapshot taken from Wikipedia with creative commons attribution-sharealike license. Give it a read and then ask your questions in the chat. We can research this topic together.

This is an old revision of this page, as edited by Jusjih (talk | contribs) at 03:31, 24 March 2008 ({{GFDL-self}}). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

Revision as of 03:31, 24 March 2008 by Jusjih (talk | contribs) ({{GFDL-self}})(diff) ← Previous revision | Latest revision (diff) | Newer revision → (diff) File:Intel-presler-copper-pillar-bump.pngNo higher resolution available.

Intel-presler-copper-pillar-bump.png (370 × 355 pixels, file size: 117 KB, MIME type: image/png)

File information
Description

SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors

Source

self-made, Nextreme Thermal Solutions

Date

20:18, 20 March 2008 (UTC)

Author

Nextreme Thermal Solutions

Permission
(Reusing this file)
GFDLI, the copyright holder of this work, hereby grant the permission to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

GFDL GNU Free Documentation License //en.wikipedia.org/Wikipedia:Text_of_the_GNU_Free_Documentation_License


If this file is eligible for relicensing, it may also be used under the Creative Commons Attribution-ShareAlike 3.0 license.
The relicensing status of this image has not yet been reviewed. You can help.		Licensing update unknown
Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.

Subject to disclaimers.


File history

Click on a date/time to view the file as it appeared at that time.

Date/TimeThumbnailDimensionsUserComment
current20:18, 20 March 2008Thumbnail for version as of 20:18, 20 March 2008370 × 355 (117 KB)Kvongunten (talk | contribs){{Information |Description = SEM image of a copper pillar bump fabricated by Intel and incorporated into their Pentium D/Presler line of microprocessors |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions |

You cannot overwrite this file.

File usage

The following page uses this file:

Categories: