.svg){kind=logo} | |
| Company type | Public |
|---|---|
| Traded as | |
| ISIN | US0316521006 |
| Industry | Semiconductors & Related Devices |
| Founded | 1968; 56 years ago (1968) |
| Founder | Hyang-Soo Kim |
| Headquarters | Tempe, Arizona, U.S. |
| Number of locations | 12 |
| Key people |
|
| Revenue |  US$6.50 billion (2023) |
| Operating income | US$470 million (2023) |
| Net income | US$362 million (2023) |
| Total assets | US$6.77 billion (2023) |
| Total equity |  US$3.96 billion (2023) |
| Number of employees | 28,700 (2023) |
| Website | amkor |
| Footnotes / references | |
Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States. The company's Arizona headquarters was originally in Chandler, then later moved to Tempe. The company was founded in 1968 and, as of 2022, has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.
With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.
Etymology
Amkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea".
History
Amkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq.
In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in United States. In 2005, Amkor spun off Integra Technologies.
In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan.
In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year.
Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan.
In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.
- ASE Technology – $11.87 Billion
- Amkor Technology – $7.1 Billion
- JCET – $3.97 Billion
- SPIL – $2.79 Billion
- Powertech Technology – $2.17 Billion
A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023.
Products
Amkors designs, packages and tests semiconductors for other companies. The company's offers include RF-antenna designs incorporated directly into or onto a chip, CMOS imaging sensors or flip chip packaging with copper pillars bumps. Amkor also offers wire bonding of semiconductors to packages as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge Protection".
See also
References
- "Giel Rutten".
- Jeff Gifford (June 18, 2020). "Valley semiconductor company names new CEO". Phoenix Business Journal.
- "Amkor Technology – Company History". Retrieved 2018-01-08.
- "US SEC: Form 10-K 2013". U.S. Securities and Exchange Commission. February 16, 2024. Retrieved February 17, 2024.
- EE Times. “Amkor's outlook improved as it moves headquarters.” June 3, 2005. Retrieved April 19, 2016.
- "Amkor relocates to Arizona - Philadelphia Business Journal". 2023-12-05. Archived from the original on 2023-12-05. Retrieved 2023-12-05.
- ^ "Company History". Amkor Technology. Retrieved January 27, 2024.
- "2000 Annual Report". Amkor Technology. 2001. Archived from the original on February 9, 2023.
- "Amkor spin-off Integra focuses on test". EE Times. October 10, 2005. Archived from the original on February 9, 2023.
- By Hayley Ringle, Phoenix Business Journal. “Amkor Tech finishes 100 percent buy of a Japanese semiconductor company.” February 11, 2016. Retrieved December 21, 2016.
- "Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm". Bloomberg.com. 15 June 2017. Archived from the original on 2020-03-17. Retrieved 2020-03-17.
- "Amkor opens new semiconductor package manufacturing and test plant in Taiwan | Solid State Technology". electroiq.com. Retrieved 2018-09-25.
- "Amkor to build $2 billion Arizona semiconductor packaging plant". reuters.com. 2023-11-30. Retrieved 2023-12-20.
- "FAQ: Antenna-in-package answers the "last mile" RF challenge, Part 2". 5gtechnologyworld.com. 2023-06-06. Retrieved 2024-10-23.
- "Amkor claims 13% of outsourced CMOS image sensor packaging". eetimes.com. 2002-11-05. Retrieved 2024-10-23.
- "Amkor Technology and Texas Instruments Deliver Industry's First Fine Pitch Copper Pillar Flip Chip Packages to Market". techonline.com. Retrieved 2024-10-23.
- "Amkor looks to EU CHIPS Act for semiconductor packaging in Portugal". eenewseurope.com. 2022-10-25. Retrieved 2024-10-23.
- "Wirebonding Is Here To Stay". semiengineering.com. 2023-10-19. Retrieved 2024-10-23.
- "Enhancing Punch MLF Packaging with Edge Protection Technology". semiengineering.com. 2023-06-14. Retrieved 2024-10-23.
- "Amkor's Edge Protection™ Technology" (PDF). semiconductorpackagingnews.com. Retrieved 2024-10-23.
External links
- Official website
- Business data for Amkor Technology Inc.:
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