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Hua Hong Semiconductor

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Chinese semiconductor foundry "Hua Hong" redirects here. For the late-Tang dynasty general, see Wang Zongdi.

Hua Hong Semiconductor Limited
Native name华虹半导体有限公司
Company typePublic
Traded asSEHK: 1347 (H share)
IndustrySemiconductor
Founded1996; 28 years ago (1996)
HeadquartersShanghai, China
RevenueIncreaseUS$1.63 billion (2021) (HuahongGrace only, not including HLMC)
Net incomeIncreaseUS$182 million (2021)
Website

Hua Hong Semiconductor Limited is a publicly listed Chinese pure-play semiconductor foundry company based in Shanghai, established in 1996 as part of China's national efforts to boost its IC industry. Currently, Hua Hong's most advanced node is achieved by its subsidiary Shanghai Huali (HLMC), which can manufacture 28/22-nm process.

It is currently mainland China's second largest chip-maker behind rival SMIC and 6th largest globally, with a market share of 2.6% in 2021.

History

In 1996, Shanghai Huahong Microelectronics Co., Ltd. (now Huahong Group) was established as part of China's national efforts to boost its IC industry.

In 1997, a joint venture HHNEC was formed between Huahong and NEC China to produce DRAM for NEC. The company phased out DRAM production in 2003 and became a pure-play foundry.

In December 2000, Grace Shanghai was formed by Grace Cayman as a pure-play foundry.

In 2011, HHNEC and Grace Shanghai was merged to form Shanghai Huahong Grace Semiconductor Manufacturing Corporation, which later fell under Hua Hong Group, a fully owned subsidiary of Hua Hong Semiconductor Limited.

In 2014, Hua Hong was listed on the Hong Kong Stock Exchange. In 2023, the company seeks to raise capital by listing themselves on the Shanghai Stock Exchange. This was to build their own advanced chip technologies amid U.S. restrictions.

Locations

Main article: List of semiconductor fabrication plants

The company currently operates three 200mm wafer fabs (HH Fab1, HH Fab2, and HH Fab3) in Shanghai located in Jinqiao, Zhangjiang and Zhangjiang respectively, with total monthly 200mm wafer capacity of approximately 180,000 wafers.

There is an R&D center (ICRD) located adjacent to Hua Hong and SMIC fabs in Zhangjiang, operated in conjunction with other integrated circuit companies, universities and research institutes, researching 7-5 nm development on 300mm wafers.

Hua Hong also owns two 300mm fabs (HH Fab5, HH Fab6) in Zhangjiang and Kangqiao, Shanghai through its subsidiary Shanghai Huali (HLMC).

There is also a new 300mm fab (HH Fab7) under construction in Wuxi's National High-Tech Industrial Development Zone. Operation at the new HH Fab7 plant began in 2019.

Processes

Currently, Hua Hong's most advanced node is achieved by its subsidiary Shanghai Huali (HLMC), which can manufacture 28/22-nm process.

See also

References

  1. Hua Hong Semiconductor Limited Reports 2021 Fourth Quarter Results todayir.com
  2. ^ "China's No 2 chip maker seeks Shanghai listing to lift capacity". 21 March 2022.
  3. ^ "Shanghai Huali Microelectronics Corporation". Archived from the original on 25 September 2022. Retrieved 14 August 2023.
  4. "China Accelerates Foundry, Power Semi Efforts". 22 November 2021.
  5. "Hua Hong NEC, Grace close to merger - sources". Reuters. 1 December 2011. Retrieved 8 July 2024.
  6. Our History and Development hkexnews.hk
  7. Chiang, Sheila (7 August 2023). "Shares of China's second largest chip foundry Hua Hong jump 13% in Shanghai debut". CNBC. Retrieved 8 July 2024.
  8. ^ About huahonggrace.com
  9. "Shanghai Ic R&D Center 上海集成电路研发中心有限公司". Archived from the original on 24 September 2022. Retrieved 29 March 2022.
  10. "上海华力".
  11. "Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform". Design And Reuse. 20 July 2020. Retrieved 4 April 2024.
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