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List of fellows of IEEE Components, Packaging & Manufacturing Technology Society

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The Fellow grade of membership is the highest level of membership, and cannot be applied for directly by the member – instead the candidate must be nominated by others. This grade of membership is conferred by the IEEE Board of Directors in recognition of a high level of demonstrated extraordinary accomplishment.

Year Fellow Citation
2005 Duane Boning For contributions to modeling and control in semiconductor manufacturing
2003 Sreejit Chakravarty For contributions to high volume manufacturing testing of VLSI circuits
2014 Manuel Dabreu For contributions to the design of resilient manufacturing processes for electronic products
2010 Andrew Kahng For contributions to the design for manufacturability of integrated circuits, and the technology roadmap of semiconductors
2017 Frank Liu For contributions to design for manufacturability of VLSI circuits
2006 Gary May For contributions to semiconductor manufacturing and engineering education
2014 Zhigang Pan For contributions to design for manufacturability in integrated circuits
2017 William Regli For contributions to 3D search, design repositories and intelligent manufacturing
1997 W Trybula For contributions in developing and advancing electronics manufacturing technology

See also

References

  1. "IEEE Fellows Directory".
  2. "2014 elevated fellow". IEEE Fellows Directory. Archived from the original on December 13, 2013.
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