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Wei Hu Koh is an electrical engineer from Pacrim Technology in Irvine, California. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 for his development of three-dimensional multichip modules and flip chip interconnects.

References

1. "2013 elevated fellow" (PDF). IEEE Fellows Directory. Archived from the original (PDF) on 2017-08-29. Retrieved 2017-04-14.

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